Tin-silver-copper (SAC) alloys are the most widely used materials for lead-free surface-mount technology (SMT) assembly. Despite the availability of other options, such as bismuth- or indium-containing alloys, SAC alloys remain the preferred choice, with approximately 65% of manufacturers using them, as reported by Soldertec in 2003. Transitioning to lead-free SMT processes involves understanding key differences […]