The electronics industry is in the midst of a significant transition driven by the European Union’s Restriction of Hazardous Substances (RoHS) Directive. This directive mandates the elimination of certain hazardous materials, including lead, from electronic assemblies. As a result, suppliers of printed wiring board laminates, component manufacturers, and assembly operations are exploring the best lead-free […]
Lead-Free SMT Soldering Defects
Tin-silver-copper (SAC) alloys are the most widely used materials for lead-free surface-mount technology (SMT) assembly. Despite the availability of other options, such as bismuth- or indium-containing alloys, SAC alloys remain the preferred choice, with approximately 65% of manufacturers using them, as reported by Soldertec in 2003. Transitioning to lead-free SMT processes involves understanding key differences […]