ACI Technologies fosters innovation in electronics manufacturing by driving collaborative applied research initiatives that enhance the capabilities of U.S. industries. By forging strong partnerships across industry, government, and academia, ACI combines expertise from diverse domains to advance technology development and implementation. With extensive experience managing large-scale cooperative research projects, ACI specializes in areas such as: […]
The Impact of Reflowing a Pb-Free Solder Alloy Using a Tin/Lead Reflow Profile on Solder Joint Integrity
The electronics industry is in the midst of a significant transition driven by the European Union’s Restriction of Hazardous Substances (RoHS) Directive. This directive mandates the elimination of certain hazardous materials, including lead, from electronic assemblies. As a result, suppliers of printed wiring board laminates, component manufacturers, and assembly operations are exploring the best lead-free […]
Lead-Free SMT Soldering Defects
Tin-silver-copper (SAC) alloys are the most widely used materials for lead-free surface-mount technology (SMT) assembly. Despite the availability of other options, such as bismuth- or indium-containing alloys, SAC alloys remain the preferred choice, with approximately 65% of manufacturers using them, as reported by Soldertec in 2003. Transitioning to lead-free SMT processes involves understanding key differences […]