ACI Technologies fosters innovation in electronics manufacturing by driving collaborative applied research initiatives that enhance the capabilities of U.S. industries. By forging strong partnerships across industry, government, and academia, ACI combines expertise from diverse domains to advance technology development and implementation.
With extensive experience managing large-scale cooperative research projects, ACI specializes in areas such as:
- Ruggedization and Reliability: Enhancing the durability of electronic assemblies and packages.
- Power Electronics Design and Packaging: Developing advanced packaging solutions for high-power applications.
- Failure Analysis: Identifying and analyzing failure modes to improve performance and reliability.
- Semiconductor Packaging: Innovating packaging methods for improved integration and efficiency.
- Production Planning: Streamlining new component integration for military systems.
Advancements in Materials and Processes
ACI’s internal research initiatives have driven breakthroughs in materials characterization and corrosion analysis. These efforts span a wide range of electronics production materials, including:
- Lead-free solder alloys and fluxes.
- Polymeric materials, such as encapsulants, underfills, and molding compounds.
- Thermoelectric assemblies and power integrated circuits.
- Area array electronic packages.
By combining cutting-edge scientific research with extensive practical manufacturing experience, ACI delivers tangible benefits to its partners. Organizations collaborating with ACI gain access to proven expertise, maximizing their R&D investments while accelerating the transition of advanced technologies into production.
Research and Development Programs
Ongoing Projects:
- SiGe SOC (System on Chip): Advancing integrated circuit technology.
- Power Packaging Lab: Enhancing power electronics design and manufacturing.
- High G Packaging: Developing rugged solutions for extreme environments.
- Power Electronic Modules for DDG1000: Supporting next-generation naval systems.
Completed Projects:
- MMIC (Monolithic Microwave Integrated Circuit).
- MEMS (Microelectromechanical Systems).
- LINK-16 and ALQ 99 military communication and jamming systems.
- APODS, SDV, TRENT, and DD(X) Search Radar programs.
- Lead-Free Manufacturing initiatives.
- Advancements in Wide Band Gap and Nanotechnology.
Electronics Manufacturing Productivity Facility (EMPF)
Established in 1984, the Electronics Manufacturing Productivity Facility (EMPF) was created to enhance manufacturing processes for military electronics systems. Under the leadership of ACI Technologies, the EMPF now operates as a National Electronics Center of Excellence, supported by a consortium of industry, academic, and government participants.
The EMPF focuses on:
- Improving responsiveness to Department of Defense (DoD) systems and warfighter needs.
- Ensuring deliverables make a measurable impact on the electronics industry.
- Transitioning advanced technologies to production environments.
- Expanding its reach to serve a national customer base.
Advanced R&D for Navy Integrated Power Systems (IPS)
ACI has initiated a new NAVSEA-sponsored project titled “Advanced R&D for Navy Integrated Power Systems (IPS).” This program explores innovative hardware for high-power naval applications, focusing on three core technologies:
- Fiber Optic Sensors: Enhancing system performance monitoring.
- Wide Band Gap Devices: Increasing power density and reliability.
- Advanced Heat Exchangers: Improving thermal management in high-power systems.
These technologies aim to improve system reliability, enhance power density, and optimize performance monitoring. ACI will validate these advancements through a demonstration vehicle simulating IPS fault anomalies. Upon successful validation, these technologies will be integrated into Navy DD(X) IPS systems to replace existing standards and set new benchmarks for operational performance.
Through its pioneering R&D efforts, ACI continues to shape the future of electronics manufacturing, ensuring robust, reliable, and innovative solutions for military and industrial applications.
