The Analytical Services Laboratory at the American Competitiveness Institute (ACI) offers a comprehensive range of solutions tailored to the specific needs of the electronics manufacturing industry. Utilizing a team of highly skilled electrical, materials, process, and manufacturing engineers and scientists, ACI conducts in-depth investigations in areas such as materials analysis, electrical characterization, and device integrity.
ACI’s expertise extends to environmental stress screening and testing for harsh conditions, providing critical insights into product reliability. All analyses adhere to industry standards, including IPC, JEDEC, ASTM, Belcore, and MIL-STD specifications. The laboratory ensures rapid, precise results, combined with root cause analysis and actionable recommendations to prevent defect recurrence.
Manufacturing Support
ACI’s Manufacturing Demonstration Facility combines decades of hands-on experience with cutting-edge electronics manufacturing equipment. This integration allows ACI’s analytical engineers to assess how modifications in manufacturing processes influence product performance and reliability.
The facility is also equipped to:
- Manufacture prototypes and samples.
- Verify material selections.
- Replicate any stage of the electronics manufacturing process.
ACI engineers collaborate closely with board and substrate fabricators, component manufacturers, and assembly teams to:
- Enhance product quality.
- Mitigate risks.
- Deliver practical solutions to electronics manufacturing challenges.
Analytical Tools and Capabilities
ACI employs state-of-the-art tools and testing methodologies to provide thorough and reliable analytical services:
- Scanning Electron Microscopy (SEM) with Energy Dispersive Spectroscopy (EDS).
- Fourier Transform Infrared Spectroscopy (FTIR).
- Ion Chromatography for contamination analysis.
- Wetting Balance Testing for solderability evaluations.
- Differential Scanning Calorimetry (DSC) and Thermographic Analysis.
- Optical Microscopy with advanced digital imaging.
- Bulk Cleanliness Testing to assess ionic contamination.
- Microsectioning for detailed structural analysis.
- Failure Analysis to determine root causes of component or assembly failures.
- Transmission X-ray Imaging for non-destructive inspection.
- Thermal Cycling Testing for durability under temperature fluctuations.
- Shear Testing for assessing mechanical robustness.
- Temperature and Humidity Testing to simulate environmental conditions.
- Vibration Testing to measure performance under mechanical stress.
- Thermal Shock Testing for rapid temperature change resistance.
- Highly Accelerated Stress Testing (HAST) for accelerated reliability assessments.
- Salt-Fog Testing for corrosion resistance evaluation.
- Reduced Oxide Solderability Activation (ROSA).
- Ultraviolet-Visible (UV-Vis) Spectroscopy.
- Sequential Electrochemical Reduction Analysis (SERA).
- Metallurgical analysis and Level 1 component failure diagnostics.
The ACI Advantage
Through its combination of advanced analytical tools, seasoned engineering expertise, and cutting-edge manufacturing support, ACI provides unmatched insights into product performance and reliability. Whether troubleshooting existing challenges or optimizing processes for the future, ACI delivers actionable, impactful solutions for the electronics manufacturing industry.
