Nanotechnology, the manipulation of matter at the atomic or molecular scale, is driving one of the most significant revolutions in electronics today. As the demand for smaller, faster, and more efficient electronic devices continues to grow, nanotechnology is playing a critical role in enabling breakthroughs that are reshaping the future of electronics. From improving the […]
The Future of Quantum Computers: How to Prepare for What’s Coming
Quantum computing represents one of the most exciting and revolutionary frontiers in technology. While classical computers rely on bits to process information as either 0 or 1, quantum computers use quantum bits, or qubits, which can exist in multiple states simultaneously. This property of quantum superposition, combined with other quantum phenomena like entanglement, holds the […]
Flexible Displays: From Concept to Mass Production
Flexible displays represent one of the most exciting advancements in modern electronics, combining cutting-edge technology with the potential to revolutionize industries ranging from consumer electronics to healthcare and automotive. These displays, capable of bending, stretching, and even folding without losing functionality, offer a new level of versatility compared to traditional rigid displays. However, the journey […]
How Artificial Intelligence is Transforming Electronics Manufacturing
Artificial intelligence (AI) is revolutionizing industries across the globe, and electronics manufacturing is no exception. As the demand for smarter, more efficient production processes increases, AI is playing a key role in transforming the way electronic devices are designed, produced, and maintained. From optimizing manufacturing lines to enhancing quality control, AI is reshaping every aspect […]
Lead-Free Soldering Summit: Addressing Military and Aerospace Challenges
The American Competitiveness Institute (ACI) hosted a Lead-Free Soldering Summit on July 13–14 at its facilities in Philadelphia, Pennsylvania. This pivotal event focused on the specialized needs of the military and aerospace electronics sectors, drawing participation from representatives of the Army, Navy, Air Force, NASA, government agencies, industry leaders, and academia. Attendees shared valuable technical […]
SAMPSON: NASA’s Approach to Lead-Free Electronics
As the global electronics industry transitions away from traditional lead-containing materials, NASA has faced the challenge of adopting lead-free soldering techniques while maintaining the high reliability required for space missions. The SAMPSON (Solder Alloy Material Properties and Strength Over NASA Needs) program is NASA’s response to understanding and overcoming the unique challenges posed by lead-free […]
Analytical Services
The Analytical Services Laboratory at the American Competitiveness Institute (ACI) offers a comprehensive range of solutions tailored to the specific needs of the electronics manufacturing industry. Utilizing a team of highly skilled electrical, materials, process, and manufacturing engineers and scientists, ACI conducts in-depth investigations in areas such as materials analysis, electrical characterization, and device integrity. […]
Applied Research and Development
ACI Technologies fosters innovation in electronics manufacturing by driving collaborative applied research initiatives that enhance the capabilities of U.S. industries. By forging strong partnerships across industry, government, and academia, ACI combines expertise from diverse domains to advance technology development and implementation. With extensive experience managing large-scale cooperative research projects, ACI specializes in areas such as: […]
The Impact of Reflowing a Pb-Free Solder Alloy Using a Tin/Lead Reflow Profile on Solder Joint Integrity
The electronics industry is in the midst of a significant transition driven by the European Union’s Restriction of Hazardous Substances (RoHS) Directive. This directive mandates the elimination of certain hazardous materials, including lead, from electronic assemblies. As a result, suppliers of printed wiring board laminates, component manufacturers, and assembly operations are exploring the best lead-free […]
Lead-Free SMT Soldering Defects
Tin-silver-copper (SAC) alloys are the most widely used materials for lead-free surface-mount technology (SMT) assembly. Despite the availability of other options, such as bismuth- or indium-containing alloys, SAC alloys remain the preferred choice, with approximately 65% of manufacturers using them, as reported by Soldertec in 2003. Transitioning to lead-free SMT processes involves understanding key differences […]